AMAT Applied Materials  0010-76136加热器

1.产 品 资 料 介 绍：

产品概述

AMAT 0010-76136 加热器是 Applied Materials 半导体设备中的核心加热元件，用于在工艺腔体或相关组件中提供稳定、可控的热量。它通过精准的温度控制，确保沉积、刻蚀、扩散等工艺所需的热环境。该部件通常作为备件用于设备维护和更换，以保证工艺的连续性和一致性。

技术参数（推断类信息，具体数值因型号不同会有差异）

• 功能类型：半导体工艺设备专用加热器

• 安装位置：工艺腔体、腔体法兰、气体通道或晶圆托盘区域

• 供电方式：常见为交流电加热（110V / 220V AC），具体根据设备配置

• 功率范围：通常在数百瓦至数千瓦之间，满足不同工艺加热需求

• 温度控制：支持精密控制，可与热电偶或红外传感器闭环控制

• 材质特性：采用高温合金或陶瓷基材料，具备耐腐蚀与耐高温性能

• 工作环境：高真空、洁净室工艺条件

应用场景

1. 化学气相沉积 (CVD) / 物理气相沉积 (PVD)

   • 加热工艺腔体或衬底，保证薄膜沉积速率与均匀性。

2. 刻蚀工艺

   • 控制腔体壁温度，减少副产物沉积并改善刻蚀一致性。

3. 离子注入

   • 对载片或腔体进行适度加热，保证工艺稳定性和掺杂效果。

4. 气体流路 / 腔体加热

   • 避免气体在管路或腔体内冷凝，提高气体输运效率与纯度。

5. 晶圆热处理

   • 为部分工艺提供热循环，改善晶圆表面结构或应力释放。

AMAT Applied Materials 0010-76136加热器 英文资料：

Product Overview

AMAT 0010-76136 heater is the core heating element in Applied Materials semiconductor equipment, used to provide stable and controllable heat in process chambers or related components. It ensures the thermal environment required for deposition, etching, diffusion and other processes through precise temperature control. This component is usually used as a spare part for equipment maintenance and replacement to ensure the continuity and consistency of the process.

Technical parameters (inferential information, specific values may vary depending on the model)

Function type: Special heater for semiconductor process equipment

Installation location: Process chamber, chamber flange, gas channel or wafer tray area

Power supply method: commonly used for AC heating (110V/220V AC), depending on the equipment configuration

Power range: typically between several hundred watts to several kilowatts, to meet different heating requirements for various processes

Temperature control: supports precision control and can be closed-loop controlled with thermocouples or infrared sensors

Material characteristics: Made of high-temperature alloy or ceramic based materials, with corrosion resistance and high temperature resistance properties

Working environment: high vacuum, clean room process conditions

Application scenarios

Chemical Vapor Deposition (CVD)/Physical Vapor Deposition (PVD)

Heat the process chamber or substrate to ensure the deposition rate and uniformity of the thin film.

etching process

Control the temperature of the cavity wall, reduce the deposition of by-products, and improve etching consistency.

ion implantation

Moderate heating is applied to the carrier or cavity to ensure process stability and doping effect.

Gas flow path/chamber heating

Prevent gas condensation in pipelines or chambers to improve gas transport efficiency and purity.

Wafer heat treatment

Provide thermal cycling for some processes to improve wafer surface structure or stress relief.

AMAT Applied Materials 0010-76136加热器 产品展示      

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218