AMAT Applied Materials 0100-02292背板

1.产 品 资 料 介 绍：

AMAT Applied Materials 0100-02292背板 英文资料：

1、 Product positioning and core values

The AMAT 0100-02292 backplane is a key interconnect component in Applied Materials semiconductor equipment, mainly responsible for signal transmission and power distribution tasks between various functional modules (such as control modules, drive modules, and detection modules) inside the equipment. In the complex electrical system of semiconductor equipment, it is like a "neural network backbone", which not only needs to ensure the high-speed and stable data transmission between multiple modules, but also to achieve precise power distribution, providing reliable hardware support for the coordinated operation of various components of the equipment. It is an important basic component to ensure the high-precision and high-efficiency operation of semiconductor equipment.

2、 Core technical characteristics and process specifications

Technical dimension

Specific parameters and implementation details

Component Attributes

High density interconnect backplane for semiconductor equipment, adapted to the integration requirements of modular electrical systems in AMAT devices

Installation and positioning

The core area inside the electrical control cabinet of the equipment is installed using guide rail or screw fixation, with an alignment accuracy of ≤ 0.1mm with each functional module interface, and a reserved heat dissipation space of ≥ 20mm around the perimeter

Core functions

Multi module signal interconnection (supporting digital and analog signal transmission), centralized power distribution (providing adaptive voltage for different modules), module connection status monitoring

Material system

The substrate is made of FR-4 glass fiber epoxy resin (dielectric constant 4.0-4.5, dielectric loss tangent ≤ 0.02), the conductive layer is electrolytic copper (thickness 35 μ m-70 μ m), and the surface is treated with gold deposition process (gold layer thickness ≥ 1 μ m)

Electrical performance

The maximum signal transmission rate can reach 10Gbps, and the signal attenuation is ≤ 0.5dB/m (at 1GHz frequency); Power distribution supports multiple voltage outputs of 5V, 12V, and 24V, with a maximum total supply current of 50A and ripple ≤ 50mV in each supply channel

Connection interface

Equipped with more than 20 standard connectors (compatible with AMAT dedicated interface protocol), contact resistance ≤ 20m Ω, plug and unplug life ≥ 1000 times, with anti misoperation design (using unique key layout)

Protective performance

Insulation resistance ≥ 10 ¹² Ω, withstand voltage ≥ 1000V AC (no breakdown for 1 minute), operating temperature range -20 ℃ to 70 ℃, humidity adaptation range 10% -90% (no condensation)

3、 Scene adaptation and performance advantages

1. Adaptation to Semiconductor Core Scenarios

High precision process equipment scenario: In lithography equipment and thin film deposition equipment, this backplane can achieve high-speed signal transmission between the control module and the precision motor drive module, controlling the signal delay within 10ns, ensuring the positioning accuracy of the motor movement (deviation ≤ 0.001mm), and meeting the micro - or even nano level process requirements of wafer processing.

 AMAT Applied Materials  0100-02292背板 产品展示      

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218