AMAT Applied Materials 0010-09416射频匹配组件

1.产 品 资 料 介 绍：

产品概述

AMAT 0010-09416 射频匹配组件（RF Matching Network Assembly）是应用材料公司半导体设备中的关键射频子系统模块。其主要作用是将射频电源与工艺腔体之间的阻抗进行实时匹配，从而确保射频能量高效传输到等离子体，提升等离子体的稳定性与均匀性，广泛应用于刻蚀（Etch）、CVD、PVD 等等离子体工艺设备。

技术参数（典型特征）

• 模块类型：射频匹配网络（RF Matching Network）

• 主要功能：射频阻抗自动匹配、能量传输优化

• 频率范围：常用于 13.56 MHz、27 MHz 等半导体行业标准频率

• 功率处理能力：可承受数百瓦到数千瓦级的射频功率（依设备配置）

• 控制方式：支持自动调谐和实时反馈，保证腔体工艺稳定性

• 兼容设备：Applied Materials 等离子刻蚀机、PVD/CVD 沉积设备

应用场景

1. 等离子体刻蚀工艺

   • 在硅片刻蚀中维持稳定的等离子体，确保刻蚀深度与形貌均匀。

2. 薄膜沉积（PVD、CVD）

   • 在沉积过程中保持功率稳定传输，提高膜层厚度和成分均匀性。

3. 离子注入和表面处理

   • 控制离子能量和分布，保障注入剂量和表面改性的一致性。

4. 制程良率提升

   • 通过精准射频控制减少偏差，降低工艺不良率。

产品优势

• 高匹配效率：优化射频能量耦合，降低反射功率损耗。

• 实时自动调谐：可根据工艺腔体条件变化自动调整匹配状态。

• 稳定性强：在高功率、高频率下仍保持长期稳定运行。

• 模块化设计：便于快速更换和维修，缩短设备停机时间。

• 提升工艺一致性：帮助获得更均匀的等离子体分布，提高芯片生产良率。

AMAT Applied Materials 0010-70131监视器模块 英文资料：

Product Overview

AMAT 0010-09416 RF Matching Network Assembly is a key RF subsystem module in Applied Materials' semiconductor equipment. Its main function is to match the impedance between the RF power supply and the process chamber in real time, thereby ensuring efficient transmission of RF energy to the plasma, improving the stability and uniformity of the plasma, and widely used in plasma process equipment such as etching (Etch), CVD, PVD, etc.

Technical parameters (typical features)

Module type: RF Matching Network

Main functions: automatic matching of RF impedance, optimization of energy transmission

Frequency range: commonly used for semiconductor industry standard frequencies such as 13.56 MHz and 27 MHz

Power processing capability: capable of withstanding RF power ranging from several hundred watts to several thousand watts (depending on device configuration)

Control mode: Supports automatic tuning and real-time feedback to ensure the stability of the cavity process

Compatible equipment: Applied Materials plasma etching machine, PVD/CVD deposition equipment

Application scenarios

Plasma etching process

Maintain stable plasma during silicon wafer etching to ensure uniform etching depth and morphology.

Thin film deposition (PVD, CVD)

Maintain stable power transmission during the sedimentation process, and improve the thickness and composition uniformity of the film layer.

Ion implantation and surface treatment

Control ion energy and distribution to ensure consistency in injection dose and surface modification.

Process yield improvement

Reduce deviation and decrease process defect rate through precise RF control.

Product advantages

High matching efficiency: Optimize RF energy coupling and reduce reflected power loss.

Real time automatic tuning: The matching status can be automatically adjusted according to changes in the process chamber conditions.

Strong stability: It can maintain long-term stable operation even at high power and high frequency.

Modular design: facilitates quick replacement and maintenance, reducing equipment downtime.

Improve process consistency: Help achieve a more uniform plasma distribution and improve chip production yield.

AMAT Applied Materials 0010-70131监视器模块 产品展示      

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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