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AMAT Applied Materials 0010-19188冷却升降机

发布时间:2025-09-25人气:
  • AMAT Applied Materials 0010-19188冷却升降机
  • AMAT Applied Materials 0010-19188冷却升降机
  • AMAT Applied Materials 0010-19188冷却升降机

AMAT Applied Materials 0010-19188冷却升降机

1.产 品 资 料 介 绍:

AMAT Applied Materials 0010‑19188 冷却升降机为半导体设备晶圆传输系统中的关键组件,集升降与冷却功能于一体,用于在工艺腔室与晶圆传输轨道间高效、稳定地传送晶圆,并在升降过程中对晶圆进行快速冷却,确保工艺精度与设备稳定性。

核心规格

项目规格备注
适用晶圆尺寸200 mm/300 mm兼容主流晶圆产线
升降行程依机型定制(常见 300–600 mm)满足不同腔室高度
升降速度0–200 mm/s 可调伺服 / 步进电机驱动
承载能力3–5 kg含晶圆承载器
冷却方式风冷 / 水冷 / 半导体制冷可选组合
温度控制范围室温–80℃精度 ±0.5℃
重复定位精度±0.05 mm确保晶圆对准
接口类型SECS/GEM、I²C、RS‑485可集成到设备控制系统
材质316L 不锈钢、高纯度氧化铝陶瓷耐腐蚀、低颗粒产生

功能特点

  • 升降与冷却一体化:减少设备占用空间,提高生产效率。
  • 高精度定位:确保晶圆在传输过程中位置精确。
  • 快速冷却:缩短晶圆降温时间,提升工艺节拍。
  • 模块化设计:便于维护与升级,可更换冷却模组。
  • 低颗粒污染:适用于洁净度要求极高的半导体环境。

典型应用

  • 刻蚀机、PVD/CVD 沉积设备晶圆上下料
  • 离子注入机晶圆传输
  • 电子束曝光机晶圆定位与冷却

AMAT Applied Materials 0010-19188冷却升降机 英文资料:

The AMAT Applied Materials 0010-19188 cooling elevator is a key component in semiconductor equipment wafer transfer systems, integrating lifting and cooling functions. It is used to efficiently and stably transfer wafers between process chambers and wafer transfer tracks, and quickly cool the wafers during the lifting process to ensure process accuracy and equipment stability.

Core specifications

Project specification remarks

Suitable for wafer sizes of 200mm/300mm, compatible with mainstream wafer production lines

The lifting stroke is customized according to the model (commonly 300-600 mm) to meet different chamber heights

Adjustable servo/stepper motor drive with lifting speed of 0-200 mm/s

Carrying capacity 3-5 kg including wafer carrier

Cooling method: optional combination of air cooling/water cooling/semiconductor cooling

Temperature control range: Room temperature -80 ℃, accuracy ± 0.5 ℃

Repeated positioning accuracy ± 0.05mm ensures wafer alignment

Interface types SECS/GEM, I ² C, RS-485 can be integrated into equipment control systems

Material: 316L stainless steel, high-purity alumina ceramic, corrosion-resistant, low particle generation

Features

Integrated lifting and cooling: reduces equipment space occupation and improves production efficiency.

High precision positioning: Ensure precise positioning of the wafer during transportation.

Rapid cooling: Shorten the cooling time of the wafer and improve the process rhythm.

Modular design: easy to maintain and upgrade, replaceable cooling module.

Low particle pollution: suitable for semiconductor environments with extremely high cleanliness requirements.

AMAT Applied Materials  0010-19188冷却升降机 产品展示      

0010-19188_bosch_cooldown_lift_w_motor_mqma012a5f_applied_materials_4.jpg

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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