AMAT Applied Materials 0010-17814端点探测器
1.产 品 资 料 介 绍：
AMAT Applied Materials 0010-17814 端点探测器
核心规格
功能特点
典型应用
AMAT Applied Materials 0010-17814端点探测器 英文资料：
AMAT Applied Materials 0010-17814 Endpoint Detector
AMAT 0010-17814 is a high-precision optical endpoint detector designed specifically for etching processes in semiconductor manufacturing. It is used to monitor the process endpoint on the wafer surface in real-time, ensuring precise control of etching depth and pattern size.
Core specifications
Project specification remarks
Suitable for platforms such as Centura, Endura, P5000, etc., compatible with multiple etching systems
Detection principle: laser reflection/interference measurement, high-sensitivity optical detection
Light source type visible/near-infrared laser wavelength depends on the model
Detection range: Nano level surface changes can detect changes in film thickness
Quick capture of process endpoint in microseconds with response time
Installation method: Vacuum flange installation, compatible with standard CF/ISO flanges
Working temperature 0-50 ° C, industrial grade environmental adaptability
Vacuum compatibility 1 × 10 ⁻⁵ Torr suitable for high vacuum process environments
Communication interface RS-485/Ethernet supports data transmission and control
Features
High precision detection: capable of identifying nanoscale film changes, ensuring precise control of etching depth
Real time monitoring: Continuously monitor the process, capture endpoints in a timely manner, and improve process repeatability
Non contact measurement: Optical measurement method avoids physical damage to the wafer surface
Anti interference capability: Special optical design to reduce plasma and background light interference
Multi mode detection: supports multiple detection modes such as reflection and interference, adapting to different process requirements
Remote diagnosis: parameter configuration and status monitoring through communication interface
Typical Applications
End point detection of silicon and silicon compound etching
Monitoring of Metal Thin Film Etching Process
Depth control of dielectric layer etching
Selective etching of multi-layer thin film structures
Various processes that require precise control of etching depth
AMAT Applied Materials 0010-17814端点探测器 产品展示
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
