AMAT Applied Materials 0100-40024互连板
1.产 品 资 料 介 绍：
- 多类型接口集成适配：集成多种工业级接口，涵盖信号接口（如 LVDS、SPI、I2C）、电力接口（如端子式电源接口）及数据传输接口（如 Ethernet、USB），可同时实现设备控制系统（如 PLC）、传感器模块、执行机构（如伺服电机）与显示单元间的连接，无需额外转接模块，简化设备内部布线，减少信号传输节点，降低信号衰减与干扰风险。
- 低阻抗信号传输设计：采用高纯度铜质导电线路（电阻率≤1.72×10⁻⁸Ω・m），线路宽度根据电流与信号频率优化设计（信号线路宽度≥0.2mm，电力线路宽度≥1mm），同时通过阻抗匹配技术（特性阻抗控制在 50Ω±5%、100Ω±5%），确保高频信号（如 1GHz 以上的数据信号）传输时反射损耗≤-20dB，信号传输速率可达 10Gbps 以上，满足半导体设备高速数据交互需求，避免因信号延迟导致的工艺控制偏差。
- 多通道独立供电分配：具备独立的电力分配通道，支持 12V DC、24V DC、48V DC 等多种电压输出，单通道最大承载电流达 10A，且通道间采用隔离设计（隔离电压≥1500V AC），可分别为设备不同功率需求的模块供电（如低功率传感器与高功率驱动电机），防止单一模块供电异常影响其他模块，保障设备整体供电稳定性。
- 小型化与轻量化设计：采用超薄基板（厚度≤1.6mm），整体尺寸符合工业标准板卡规格（如 100mm×150mm、120mm×180mm），重量≤100g，可适配设备内部狭窄安装空间（如设备背板、模块间隙），同时减轻设备整体重量，便于设备组装与维护。
- 堆叠式与模块化布局：支持堆叠式安装，通过板对板连接器实现多块互连板的垂直堆叠，堆叠间距≥5mm，确保散热空间充足；同时采用模块化布局，将接口区域、信号处理区域与电力分配区域分区设计，各区域间设置屏蔽隔板，减少不同类型信号间的干扰，且便于针对特定区域进行检修与更换，提升维护效率。
AMAT Applied Materials 0100-40024互连板 英文资料：
1、 Efficient circuit connection: ensuring stable transmission of semiconductor equipment signals and power
As the "connection bridge" between various modules of semiconductor equipment, the 0100-40024 interconnect board focuses on efficient and stable circuit connection capabilities to meet the complex signal interaction and power distribution needs of the equipment
Multi type interface integration and adaptation: Integrating multiple industrial grade interfaces, including signal interfaces (such as LVDS, SPI, I2C), power interfaces (such as terminal power interfaces), and data transmission interfaces (such as Ethernet, USB), it can simultaneously connect equipment control systems (such as PLC), sensor modules, actuators (such as servo motors), and display units without the need for additional adapter modules, simplifying internal wiring of equipment, reducing signal transmission nodes, and minimizing signal attenuation and interference risks.
Low impedance signal transmission design: High purity copper conductive lines (resistivity ≤ 1.72 × 10 ⁻⁸Ω· m) are used, and the line width is optimized according to the current and signal frequency (signal line width ≥ 0.2mm, power line width ≥ 1mm). At the same time, impedance matching technology (characteristic impedance controlled at 50 Ω± 5%, 100 Ω± 5%) is used to ensure that the reflection loss during high-frequency signal transmission (such as data signals above 1GHz) is ≤ -20dB, and the signal transmission rate can reach 10Gbps or more, meeting the high-speed data exchange requirements of semiconductor equipment and avoiding process control deviations caused by signal delay.
Multi channel independent power supply distribution: it has independent power distribution channels, supports 12V DC, 24V DC, 48V DC and other voltage outputs, the maximum carrying current of a single channel is 10A, and isolation design (isolation voltage ≥ 1500V AC) is adopted between channels, which can supply power to modules with different power requirements of the equipment (such as low-power sensors and high-power drive motors), prevent abnormal power supply of a single module from affecting other modules, and ensure the overall power supply stability of the equipment.
2、 Compact structural design: adapted to the spatial layout requirements of semiconductor equipment
In response to the compact internal space and module density of semiconductor devices, the 0100-40024 interconnect board focuses on miniaturization and compatibility in structural design to improve equipment space utilization:
Miniaturization and Lightweight Design: Adopting ultra-thin substrate (thickness ≤ 1.6mm), the overall size meets the industrial standard board specifications (such as 100mm × 150mm, 120mm × 180mm), weight ≤ 100g, and can adapt to narrow installation spaces inside the equipment (such as equipment backboards and module gaps), while reducing the overall weight of the equipment and facilitating equipment assembly and maintenance.
Stackable and modular layout: Supports stacked installation, achieving vertical stacking of multiple interconnected boards through board to board connectors, with a stacking spacing of ≥ 5mm, ensuring sufficient heat dissipation space; At the same time, a modular layout is adopted to partition the interface area, signal processing area, and power distribution area. Shielding partitions are installed between each area to reduce interference between different types of signals, and to facilitate maintenance and replacement for specific areas, thereby improving maintenance efficiency.
AMAT Applied Materials 0100-40024互连板 产品展示
产品视频
3.其他产品
MOISTURE.IQ-1-6-1-1-1-0-0 分析仪
XV-440-10TVB-1-50 触摸屏
NI PCI4451 数据采集卡
4.其他英文产品
WATLOWANAFZE PPC-TB50 module
SY-60399001R SY-60301001RB Output card
SY-60702001RA SY-61025006RA Output card
| 710-608020-01 | 193X740ACG01 | 531X309PCAJG1 |
| 710-606238-005 | 193X803BCG03 | 073-614993-000 |
| 710-606238-00 | 6DD1684-0FB0 | 500-22333-001 |
| 710-566009-00 | 6DD1684-0EF0 | 710-660800-00 |
| 710-566008-00 | 03-417236-00 | 720-06888-001 |
| 710-566006-00 | A90-031-03 | 710-658177-20 |
| 710-5000817-00 | 531X111PSHABG1 | F31X128HMSA |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
