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AMAT Applied Materials 0010-00557热交换器

发布时间:2025-09-24人气:
  • AMAT Applied Materials 0010-00557热交换器
  • AMAT Applied Materials 0010-00557热交换器
  • AMAT Applied Materials 0010-00557热交换器

AMAT Applied Materials 0010-00557热交换器

1.产 品 资 料 介 绍:

Applied Materials 0010-00557 是一款专为半导体制造设备设计的高效热交换器,用于晶圆工艺过程中对冷却介质进行精确温度控制,确保工艺稳定性与设备可靠性。

核心参数

项目规格
品牌 / 型号Applied Materials 0010-00557
适用范围半导体刻蚀、沉积、离子注入等需精密温控的设备
结构形式板翅式或钎焊板式(具体依机型而定)
设计压力≤2.0 MPa(部分机型可达 3.0 MPa)
设计温度-20~150℃
材质主体:不锈钢 / 铜合金;密封:耐高温氟橡胶
传热系数2500~5000 W/(㎡・K)(视工况)
接口类型快接法兰或螺纹连接,常见尺寸 DN25、DN40
清洁度符合 SEMI S2/S8 标准,适用于高洁净环境

产品特点

  • 高效传热:采用紧凑型设计,增大换热面积,提升冷却效率,降低能耗。
  • 耐腐蚀:选用耐酸、碱、有机溶剂的材料,适应强化学环境。
  • 低流阻:优化流道设计,减小压降,确保介质稳定循环。
  • 易维护:模块化结构,支持在线快速更换,减少停机时间。

典型应用

  • 刻蚀机、PVD/CVD 沉积设备的工艺气体预冷
  • 离子注入机靶台冷却系统
  • 光刻机曝光光学系统温控
  • 扩散炉载气冷却

AMAT Applied Materials  0010-00557热交换器 英文资料:

Applied Materials 0010-00557 is an efficient heat exchanger designed specifically for semiconductor manufacturing equipment, used for precise temperature control of cooling media during wafer processing to ensure process stability and equipment reliability.

Core parameters

Project specifications

Brand/Model Applied Materials 0010-00557

Scope of application: Equipment that requires precise temperature control, such as semiconductor etching, deposition, ion implantation, etc

Structural form: Plate fin or brazed plate (depending on the model)

Design pressure ≤ 2.0 MPa (some models can reach up to 3.0 MPa)

Design temperature -20~150 ℃

Material body: stainless steel/copper alloy; Sealing: High temperature resistant fluororubber

Heat transfer coefficient 2500-5000 W/(㎡· K) (depending on operating conditions)

Interface type quick connect flange or threaded connection, common sizes DN25, DN40

Cleanliness meets SEMI S2/S8 standards and is suitable for high cleanliness environments

Product Features

Efficient heat transfer: adopting a compact design, increasing the heat transfer area, improving cooling efficiency, and reducing energy consumption.

Corrosion resistance: Materials that are resistant to acid, alkali, and organic solvents are selected to adapt to strong chemical environments.

Low flow resistance: Optimize channel design, reduce pressure drop, and ensure stable circulation of the medium.

Easy to maintain: Modular structure, supports online quick replacement, reduces downtime.

Typical Applications

Pre cooling of process gases for etching machines and PVD/CVD deposition equipment

Cooling system for ion implantation machine target platform

Temperature control of lithography machine exposure optical system

Diffusion furnace carrier gas cooling

AMAT Applied Materials  0010-00557热交换器 产品展示      

applied_materials_0010-00557_0010-00506_heat_exchanger_amat_1.jpg

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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