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AMAT Applied Materials 0021-96788气动模块

发布时间:2025-09-25人气:
  • AMAT Applied Materials 0021-96788气动模块
  • AMAT Applied Materials 0021-96788气动模块

AMAT Applied Materials 0021-96788气动模块

1.产 品 资 料 介 绍:

AMAT Applied Materials 0021‑96788 是一款模块化气动模块,主要用于晶圆制造设备的气体分配与传输控制,适配 Centura、Endura 等平台。

核心规格

项目规格备注
适用平台Centura、Endura、P5000 等多腔室半导体制造系统
功能定位气体分配与传输控制用于工艺气体、吹扫气、控制气
接口类型G1/2″(BSPP)或 NPT 自密封接头部分版本支持直通连接
最大工作压力6.9 bar(100 psi)非真空应用
流量系数 Cv1.6标准配置
工作温度-28.9℃~65.6℃需干燥、洁净压缩空气
材质阳极氧化铝合金本体;不锈钢阀件;丁腈橡胶密封耐腐蚀、耐磨
安装方式直装式或通过工具盘安装便于维护与更换

功能特点

  • 快速切换与低泄漏:采用自密封接口设计,更换工具或模块时可快速切断气源,减少气体浪费与污染风险。
  • 多通道集成:可同时管理多条气路,支持工艺气体、吹扫气、控制气的独立分配。
  • 高可靠性:结构紧凑,适应晶圆制造环境的高洁净度与频繁启停要求。
  • 灵活配置:支持不同接口组合与阀组配置,满足多样化工艺需求。

典型应用

  • 化学气相沉积(CVD)与物理气相沉积(PVD)系统
  • 刻蚀(Etch)与离子注入系统
  • 晶圆传输与装载 / 卸载(Load/Unload)模块
  • 气体混合与流量控制单元

AMAT Applied Materials 0021-96788气动模块 英文资料:

AMAT Applied Materials 0021-96788 is a modular pneumatic module primarily used for gas distribution and transmission control in wafer manufacturing equipment, compatible with platforms such as Centura and Endura.

Core specifications

Project specification remarks

Suitable for multi chamber semiconductor manufacturing systems such as Centura, Endura, P5000, etc

Functional positioning: Gas distribution and transmission control for process gas, purge gas, and control gas

Interface type G1/2 "(BSPP) or NPT self sealing joint partial versions support direct connection

Maximum working pressure 6.9 bar (100 psi) for non vacuum applications

Flow coefficient Cv 1.6 standard configuration

Working temperature -28.9 ℃~65.6 ℃ requires dry and clean compressed air

Material: anodized aluminum alloy body; Stainless steel valve components; Nitrile rubber seal is corrosion-resistant and wear-resistant

Installation method: direct installation or installation through a tool tray for easy maintenance and replacement

Features

Fast switching and low leakage: Adopting a self sealing interface design, the gas source can be quickly cut off when replacing tools or modules, reducing gas waste and pollution risks.

Multi channel integration: capable of managing multiple gas paths simultaneously, supporting independent distribution of process gas, purge gas, and control gas.

High reliability: Compact structure, suitable for high cleanliness and frequent start stop requirements in wafer manufacturing environment.

Flexible configuration: Supports different interface combinations and valve group configurations to meet diverse process requirements.

Typical Applications

Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) Systems

Etch and ion implantation system

Wafer Transfer and Load/Unload Module

Gas mixing and flow control unit

AMAT Applied Materials  0021-96788气动模块  产品展示      

applied_materials_0021-96788.jpg

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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