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AMAT Applied Materials 0010-08670顶盖

发布时间:2025-09-25人气:
  • AMAT Applied Materials 0010-08670顶盖
  • AMAT Applied Materials 0010-08670顶盖
  • AMAT Applied Materials 0010-08670顶盖

AMAT Applied Materials  0010-08670顶盖

1.产 品 资 料 介 绍:

AMAT Applied Materials 0010‑08670 顶盖为半导体设备真空腔室用密封端盖,材质通常为耐蚀 5083 铝合金,表面经硬质阳极氧化处理,可在 0–40℃、真空度达 10⁻⁵ Pa 级环境下长期稳定工作。

关键参数

项目规格备注
适用设备Centura、Endura、P5000 等多腔室平台适配 200 mm/300 mm 晶圆工艺
材质5083 铝合金耐蚀、低应力、热膨胀系数与腔体匹配
表面处理硬质阳极氧化(内侧)膜厚符合 SEMATECH 标准
密封形式金属密封环或氟橡胶 O 型圈可耐酸碱及等离子体腐蚀
外形尺寸定制,常见 Φ800–1000 mm随腔体直径而定
重量≈80–150 kg相较不锈钢减重约 50%
工作温度0–40℃建议温控 ±2℃
真空等级10⁻⁵ Pa 级漏率 < 1×10⁻⁹ mbar・L/s
认证SEMI S2、CE、UL符合半导体行业安全标准

性能特点

  • 高精度密封:在温度波动 ±2℃时,密封面形变量仅约 0.01 mm,有效延长密封圈寿命。
  • 低应力设计:与腔体材料热膨胀系数匹配,降低热循环应力,防止密封失效。
  • 耐腐蚀性强:内侧硬质氧化层可耐受等离子体、酸碱等工艺环境。
  • 易于维护:重量轻,支持双人快速更换,减少停机时间。

典型应用

  • 刻蚀(Etch)与化学气相沉积(CVD)系统
  • 物理气相沉积(PVD)与原子层沉积(ALD)系统
  • 离子注入机及晶圆传输腔室

AMAT Applied Materials  0010-08670顶盖 英文资料:

The top cover of AMAT Applied Materials 0010-08670 is a sealed end cover for semiconductor equipment vacuum chambers. The material is usually corrosion-resistant 5083 aluminum alloy, and the surface is treated with hard anodizing. It can work stably for a long time in an environment with a vacuum degree of 10 ⁻⁵  Pa at 0-40 ℃.

key parameters

Project specification remarks

Suitable for multi chamber platforms such as Centura, Endura, P5000, etc. to adapt to 200mm/300mm wafer processes

Material: 5083 aluminum alloy, corrosion-resistant, low stress, thermal expansion coefficient matched with the cavity

Surface treatment: Hard anodizing (inner side) film thickness meets SEMATECH standards

Sealing form: Metal sealing ring or fluororubber O-ring can withstand acid, alkali and plasma corrosion

Customized external dimensions, commonly ranging from Φ 800 to 1000 mm depending on the diameter of the cavity

Weight ≈ 80-150 kg, reduced by about 50% compared to stainless steel

Working temperature 0-40 ℃, recommended temperature control ± 2 ℃

Vacuum level 10 ⁻⁵  Pa leakage rate<1 × 10 ⁻⁹  mbar · L/s

Certification: SEMI S2, CE, UL comply with semiconductor industry safety standards

Performance Characteristics

High precision sealing: When the temperature fluctuates by ± 2 ℃, the deformation of the sealing surface is only about 0.01 mm, effectively extending the life of the sealing ring.

Low stress design: matched with the thermal expansion coefficient of the cavity material, reducing thermal cycling stress and preventing seal failure.

Strong corrosion resistance: The inner hard oxide layer can withstand process environments such as plasma, acid and alkali.

Easy to maintain: lightweight, supports quick replacement by two people, reduces downtime.

Typical Applications

Etch and CVD systems

Physical Vapor Deposition (PVD) and Atomic Layer Deposition (ALD) Systems

Ion implantation machine and wafer transfer chamber

AMAT Applied Materials   0010-08670顶盖  产品展示      

applied_materials_0010-08670_chamber_top_cover_amat_3.jpg

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218

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