AMAT Applied Materials 0090-77082化学技术设备
1.产 品 资 料 介 绍：
- 工艺定位：作为 AMAT 化学技术类设备，大概率聚焦半导体晶圆化学处理环节，参考 CMP（化学机械平坦化）或 ECD（电化学沉积）工艺特性，可能用于晶圆表面抛光、金属沉积或化学清洗等核心工序
- 适配晶圆规格：预计支持 150mm、200mm 及 300mm 多尺寸晶圆处理，可通过模块化配置实现不同尺寸晶圆的快速切换，适配研发与量产多场景需求
- 化学兼容性：兼容铜、钨、氧化物、多晶硅等多种晶圆材料，可适配强酸 / 碱研磨液、电镀液等化学试剂，参考 Mirra CMP 系统对多材料的处理能力
- 工艺均匀性：采用多区域控制模块（如 CMP 系统的多区研磨头），可实现晶圆中心到边缘的高精度均匀处理，薄膜厚度或抛光去除率偏差控制在纳米级，满足 3x 纳米及更先进节点需求
- 实时监控能力：可能集成原位端点检测技术（如宽带分光术、涡流传感），实时追踪工艺进度，避免过处理或欠处理导致的晶圆报废，类似 Reflexion LK CMP 的 Window-in-Pad 技术
- 自动化控制：支持全流程可编程控制，可预设多套工艺配方，适配铜、镍、锡等不同金属或介电质的化学处理需求，配合 “无示教” 自动化功能减少停机调整时间
- 防腐结构：接触化学试剂的腔体及管路采用耐蚀材质（如 PTFE、 Hastelloy 合金），参考 CMP 系统对强酸 / 碱试剂的适配设计，避免化学腐蚀导致的设备损耗
- 晶圆保护：可能配备类似 Nokota ECD 系统的 SafeSeal™组件，处理前对晶圆进行密封防护，配合处理后清洁、检查流程，降低化学污染风险，减少晶圆报废率
- 维护便利性：采用模块化工艺腔室设计，支持 HotSwap™腔室外操作机制，可在不中断生产的情况下更换耗材或维护组件，提升设备运行效率
- 洁净与安全设计：设备内部集成高效排风与废液回收系统，避免化学试剂挥发污染洁净车间，同时配备泄漏检测装置，出现试剂渗漏时自动切断供应并报警
- 耐受能力：工作温度范围预计达 0-60℃，适配半导体洁净车间温湿度波动，核心组件可承受 - 45℃至 + 105℃的极端存储温度，参考工业级防腐设备的环境适应性
- 认证标准：符合 UL、CE 安全认证及 RoHS 环保要求，化学试剂存储与排放符合半导体行业环保规范，适配全球晶圆厂合规性管控需求
- 吞吐效率：采用多腔室并行设计（如 CMP 系统的多抛光盘配置），单批次处理能力提升 30% 以上，配合优化的晶圆传输逻辑，年有效生产时间可增加 300 小时以上
- 功能扩展：预留模块化接口，可灵活搭载预清洗腔（如 Siconi 预清洗技术）、干燥单元（如 Marangoni 效应干燥器），适配低温工艺、厚膜沉积等进阶需求
AMAT Applied Materials 0090-77082化学技术设备 英文资料：
1. Process adaptation and core functions (0090-77082 chemical technology equipment)
Process positioning: As an AMAT chemical technology equipment, it is likely to focus on the chemical processing of semiconductor wafers, referring to the characteristics of CMP (chemical mechanical planarization) or ECD (electrochemical deposition) processes, and may be used for core processes such as wafer surface polishing, metal deposition, or chemical cleaning
Compatible with wafer specifications: It is expected to support processing of 150mm, 200mm, and 300mm multi size wafers, and can quickly switch between different sizes of wafers through modular configuration, adapting to the needs of research and development and mass production in multiple scenarios
Chemical compatibility: Compatible with various wafer materials such as copper, tungsten, oxide, and polycrystalline silicon, and can adapt to strong acid/alkali grinding solutions, electroplating solutions, and other chemical reagents. Refer to Mirra CMP system's ability to handle multiple materials
2. Performance and Control Accuracy (0090-77082 Chemical Technology Equipment)
Process uniformity: By using multi zone control modules (such as multi zone grinding heads in CMP systems), high-precision uniform processing from the center to the edge of the wafer can be achieved. The deviation of film thickness or polishing removal rate is controlled at the nanometer level, meeting the requirements of 3x nanometer and more advanced nodes
Real time monitoring capability: may integrate in-situ endpoint detection technology (such as broadband spectroscopy, eddy current sensing), track process progress in real time, avoid wafer scrap caused by over or under processing, similar to Reflexion LK CMP's Window in Pad technology
Automation control: supports full process programmable control, can preset multiple process formulas, adapt to the chemical treatment needs of different metals or dielectrics such as copper, nickel, tin, etc., and reduce downtime adjustment time with the "no teaching" automation function
3. Structural design and protective performance (0090-77082 chemical technology equipment)
Anti corrosion structure: The chambers and pipelines that come into contact with chemical reagents are made of corrosion-resistant materials (such as PTFE, Hastelloy alloy), with reference to the CMP system's adaptation design for strong acid/alkali reagents, to avoid equipment loss caused by chemical corrosion
Wafer protection: may be equipped with SafeSeal similar to Nokota ECD system ™ Components: Seal and protect the wafer before processing, cooperate with the cleaning and inspection process after processing, reduce the risk of chemical contamination, and decrease the wafer scrap rate
Maintenance convenience: adopting modular process chamber design, supporting HotSwap ™ The outdoor operation mechanism of the chamber can ｒｅｐｌａｃｅ consumables or maintain components without interrupting production, improving equipment operating efficiency
4. Environment and Compliance (0090-77082 Chemical Technology Equipment)
Cleanliness and safety design: The equipment is equipped with an integrated high-efficiency exhaust and waste liquid recovery system to prevent chemical reagent volatilization from contaminating the clean workshop. It is also equipped with a leak detection device that automatically cuts off the supply and alarms in case of reagent leakage
AMAT Applied Materials 0090-77082化学技术设备 产品展示
产品视频
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| PMA42Q-11100-00 | AMAT 0100-76267 | PFTL101AE-2.0KN 3BSE004213R1 2.0KN |
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| PMA42Q-01100-00 | AMAT 0100-90221 | PFTL201CE |
| PMA42P-11100-00 | AMAT 0100-77034 | PFTL201DE |
| PMA42P-10100-00 | AMAT 0100-00042 | PFTL101BE-2.0KN 3BSE004214R1 2.0KN |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
