AMAT 0041-76691加热器

1.产 品 资 料 介 绍：

AMAT 0041-76691 加热器

产品概述

AMAT（Applied Materials）0041-76691 加热器是应用于半导体制造设备中的专用工艺加热部件，主要用于控制真空腔体或工艺平台的温度环境。通过精确的加热和温度稳定性管理，该加热器为沉积、刻蚀、离子注入等工艺提供理想的工艺条件，保障薄膜沉积质量与工艺稳定性。

技术参数（典型方向，具体参数需参考原厂资料）

• 加热方式：电阻加热/陶瓷加热片形式

• 温控范围：支持常温至数百摄氏度的稳定调节

• 精度：具备闭环温控机制，温度控制精度高

• 兼容性：适配 AMAT PVD、CVD 等平台

• 材料特性：耐高温、抗腐蚀，适应真空和反应性气氛环境

应用场景

1. 半导体前道工艺

   • CVD（化学气相沉积）：加热反应腔体或晶圆基底，确保薄膜均匀沉积。

   • PVD（物理气相沉积）：为靶材或腔体提供稳定热源，保证沉积层厚度一致。

   • 刻蚀工艺：在等离子体刻蚀中保持腔体温度稳定，防止残留物沉积。

2. 离子注入系统

   • 提供离子注入过程中所需的基板预热或工艺恒温，改善离子植入均匀性。

3. 晶圆处理与清洗

   • 在湿法或干法清洗工艺中，利用加热实现化学反应速率提升与清洗效率优化。

4. 真空腔体环境控制

   • 用于维持腔体内部恒定温度，避免冷凝或颗粒污染。

   • 提升真空系统在高温环境下的稳定性。

5. 研发与实验平台

   • 应用于工艺开发实验室，进行新型材料沉积与工艺窗口探索。

AMAT 0041-76691加热器  英文资料：

AMAT 0041-76691 Heater

Product Overview

AMAT (Applied Materials) 0041-76691 heater is a specialized process heating component used in semiconductor manufacturing equipment, mainly used to control the temperature environment of vacuum chambers or process platforms. Through precise heating and temperature stability management, this heater provides ideal process conditions for deposition, etching, ion implantation, and other processes, ensuring the quality and stability of thin film deposition.

Technical parameters (typical direction, specific parameters need to refer to the original factory information)

Heating method: resistance heating/ceramic heating plate form

Temperature control range: supports stable adjustment from room temperature to several hundred degrees Celsius

Accuracy: Equipped with a closed-loop temperature control mechanism, high temperature control accuracy

Compatibility: Compatible with AMAT PVD, CVD and other platforms

Material characteristics: high temperature resistance, corrosion resistance, suitable for vacuum and reactive atmosphere environments

Application scenarios

Semiconductor front-end process

CVD (Chemical Vapor Deposition): Heating the reaction chamber or wafer substrate to ensure uniform deposition of thin films.

PVD (Physical Vapor Deposition): Provides a stable heat source for the target material or cavity, ensuring consistent thickness of the deposited layer.

Etching process: Maintain stable chamber temperature during plasma etching to prevent residue deposition.

Ion implantation system

Provide substrate preheating or process constant temperature required during ion implantation to improve ion implantation uniformity.

Wafer processing and cleaning

In wet or dry cleaning processes, heating is used to improve chemical reaction rates and optimize cleaning efficiency.

Vacuum chamber environment control

Used to maintain a constant temperature inside the cavity, avoiding condensation or particle contamination.

Improve the stability of vacuum systems in high-temperature environments.

R&D and experimental platform

Applied to the process development laboratory for exploring new material deposition and process windows.

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218