AMAT Applied Materials 0190-14783射频匹配盒

1.产 品 资 料 介 绍：

产品概述

AMAT 0190-14783 射频匹配盒是 Applied Materials 半导体设备中用于射频功率传输和阻抗匹配的关键模块。它用于调节射频电源与工艺腔体之间的阻抗匹配，确保射频能量高效传输至工艺区域，从而实现等离子体沉积、刻蚀或清洗过程的均匀性和稳定性。射频匹配盒是保证高精度工艺效果和设备可靠运行的重要组成部分。

技术参数（典型特征）

• 类型：射频匹配盒 / RF Match Box

• 功能：射频阻抗匹配，优化功率传输，保护射频电源

• 工作频率：通常在几十 MHz 至几百 MHz（依工艺要求）

• 最大功率：根据设备规格设计，可承受高射频功率输出

• 接口类型：射频输入/输出接口，与射频电源及工艺腔体连接

• 控制方式：手动或自动匹配，可与控制器实现闭环调节

• 工作环境：洁净室兼容，耐高温、耐电磁干扰

• 兼容设备：Applied Materials 各类等离子体沉积（CVD/PVD）、刻蚀（Etch）设备

应用场景

1. 射频功率传输优化

   • 调节射频源与工艺腔体的阻抗匹配，减少反射功率，提高能量利用率。

2. 等离子体沉积与刻蚀

   • 确保等离子体均匀稳定，提升薄膜沉积均匀性和刻蚀精度。

3. 设备保护

   • 减少射频反射对射频电源的损害，延长设备寿命。

4. 工艺参数闭环控制

   • 与控制器配合，实现自动阻抗匹配，保证工艺重复性和一致性。

产品优势

• 射频匹配精确：保证射频功率高效传输，提高工艺一致性。

• 可靠性强：耐高温、耐电磁干扰，适应半导体工艺环境。

• 模块化设计：便于安装、拆卸和维护，提高设备可用性。

• 兼容性广：支持多种 AMAT 等离子体设备和射频系统。

• 提升工艺稳定性：通过优化射频能量分布，实现薄膜沉积和刻蚀过程稳定。

AMAT Applied Materials 0190-14783射频匹配盒 英文资料：

Product Overview

AMAT 0190-14783 RF Matching Box is a key module used for RF power transmission and impedance matching in Applied Materials semiconductor equipment. It is used to adjust the impedance matching between the RF power supply and the process chamber, ensuring efficient transmission of RF energy to the process area, thereby achieving uniformity and stability in plasma deposition, etching, or cleaning processes. The RF matching box is an important component to ensure high-precision process effects and reliable equipment operation.

Technical parameters (typical features)

Type: RF Match Box/RF Match Box

Function: RF impedance matching, optimizing power transmission, protecting RF power supply

Operating frequency: usually ranging from tens of MHz to hundreds of MHz (depending on process requirements)

Maximum power: Designed according to device specifications, capable of withstanding high RF power output

Interface type: RF input/output interface, connected to RF power supply and process chamber

Control mode: manual or automatic matching, can achieve closed-loop adjustment with the controller

Work environment: cleanroom compatible, high temperature resistant, and resistant to electromagnetic interference

Compatible devices: Various plasma deposition (CVD/PVD) and etching (Etch) equipment from Applied Materials

Application scenarios

RF power transmission optimization

Adjust the impedance matching between the RF source and the process chamber to reduce reflected power and improve energy utilization efficiency.

Plasma deposition and etching

Ensure uniform and stable plasma, improve film deposition uniformity and etching accuracy.

equipment protection

Reduce the damage of RF reflection to RF power supply and extend the lifespan of equipment.

Closed loop control of process parameters

Cooperate with the controller to achieve automatic impedance matching, ensuring process repeatability and consistency.

Product advantages

RF matching accuracy: ensuring efficient transmission of RF power and improving process consistency.

Strong reliability: resistant to high temperatures, electromagnetic interference, and suitable for semiconductor process environments.

Modular design: easy to install, disassemble, and maintain, improving equipment availability.

Wide compatibility: Supports multiple AMAT plasma devices and RF systems.

Improve process stability: By optimizing the distribution of RF energy, achieve stable thin film deposition and etching processes.

AMAT Applied Materials  0190-14783射频匹配盒 产品展示      

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218