AMAT Applied Materials 0190-23441启动模块

1.产 品 资 料 介 绍：

核心信息

功能与价值

• 边缘保护：减少边缘薄膜厚度偏差，降低边缘颗粒污染。
• 提高良品率：稳定工艺参数，减少晶圆报废。
• 延长寿命：保护腔室壁免受等离子体侵蚀，减少维护频率。
• 材料多样：可按工艺需求选择不同陶瓷材质。

安装与维护

1. 安装
   • 先清洁腔室与环架，确保无颗粒残留。
   • 将阴影环嵌入环架，对准定位槽固定，避免安装应力。
   • 安装后检查平整度，防止干涉晶圆传输。
2. 更换要点
   • 定期检查磨损、裂纹及薄膜沉积情况，通常每 50–200 批次更换。
   • 新件需烘烤去气，防止引入杂质。
   • 更换后进行腔室清洁与工艺校准。
3. 维护
   • 每批次生产后用干氮吹扫。
   • 每 3–6 个月进行一次拆检与清洁，必要时进行等离子体清洗。

AMAT Applied Materials  0190-23441启动模块 英文资料：

AMAT 0190-23441 is not a startup module, but a Shadow Ring ceramic ｉｎｓｅｒｔ used in semiconductor thin film deposition equipment (such as PVD, CVD). It has a diameter of 197 mm and is mostly made of Al ₂ O3 or aluminum nitride. It is used to block excess plasma or particles, protect wafer edges and chamber walls, and improve film uniformity and yield.

core message

Project specifications/characteristics remarks

Type: Ceramic Shadow Ring ｉｎｓｅｒｔ, Non Electrical Startup Module

Size diameter 197 mm standard PVD chamber adaptation

Materials such as Al ₂ O ∝ and aluminum nitride are resistant to high temperatures and corrosion

Function to block plasma/particles, protect wafer edges and optimize film uniformity

Application of PVD, CVD, etching and other process chambers for wafer edge protection

Installation method: Embed the metal ring frame and fix it on the chamber wall. Accurate positioning is required for installation

function and value

Edge protection: reduce the deviation of edge film thickness and minimize edge particle contamination.

Improve yield rate: stabilize process parameters and reduce wafer scrap.

Extend lifespan: Protect chamber walls from plasma erosion and reduce maintenance frequency.

Diverse materials: Different ceramic materials can be selected according to process requirements.

Installation and maintenance

install

Clean the chamber and ring frame first to ensure there are no residual particles.

ｉｎｓｅｒｔ the shadow ring into the ring frame, align it with the positioning groove and fix it to avoid installation stress.

Check the flatness after installation to prevent interference with wafer transfer.

Key points for replacement

Regularly inspect for wear, cracks, and film deposition, usually replacing every 50-200 batches.

New parts need to be baked to remove air and prevent the introduction of impurities.

Clean the chamber and perform process calibration after replacement.

maintenance

Blow dry nitrogen after each batch of production.

Disassemble and clean every 3-6 months, and perform plasma cleaning if necessary.

AMAT Applied Materials 0190-23441启动模块 产品展示      

 产品视频

3.其他产品

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GJR2385200R1010控制器模块
GJR2395400R1010 83SR06C-E控制板

4.其他英文产品

AMAT 0100-09156 Multi-function I/O card
AMAT 0100-09126 Serial control card
AMAT 0100-09117 Multi-function I/O card

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218