AMAT Applied Materials 0100-09022探测器板组件
1.产 品 资 料 介 绍：
- 状态感知：通过 AI（模拟输入）功能实时采集反应腔体内的压力波动信号（范围通常为 1-1000mTorr）与温度梯度数据（精度达 ±0.1℃），捕捉薄膜生长过程中的环境变化；
- 工艺修正：将数字控制系统的调整指令转化为模拟量（如气体流量阀的开度信号），通过 AO（模拟输出）功能动态补偿压力偏差，确保沉积速率稳定在 10-500nm/min 的目标区间，直接影响芯片绝缘层、金属布线层的厚度均匀性。
- 终点侦测支撑：接收反应室光学传感器传输的光信号模拟量（对应不同材料刻蚀的特征波长），经预处理后传递至主控制器，为 “刻蚀终点判定算法” 提供原始数据，避免过度刻蚀导致的硅基底损伤或刻蚀不足引发的电路短路；
- 速率动态调节：根据刻蚀速率传感器的反馈信号（通常为 nm/s 级），输出精准电流信号控制射频电源功率，使刻蚀速率偏差控制在 ±5% 以内，适配逻辑芯片、存储芯片等不同器件的图形化需求。
AMAT Applied Materials 0100-09022探测器板组件 英文资料：
1、 Core process scenario: the "signal center" of semiconductor front-end manufacturing
As an exclusive adaptation component of the AMAT Precision 5000 series CVD etching machine, its application strictly focuses on the core process of 12 inch wafer front-end manufacturing, and supports process stability through a closed-loop system of "signal acquisition processing output"
1. Precise control of thin film deposition process
In the CVD (Chemical Vapor Deposition) process, components play a dual critical role:
State perception: Real time collection of pressure fluctuation signals (usually ranging from 1-1000 mTorr) and temperature gradient data (with an accuracy of ± 0.1 ℃) inside the reaction chamber through AI (analog input) function, capturing environmental changes during the film growth process;
Process correction: Convert the adjustment instructions of the digital control system into analog quantities (such as the opening signal of the gas flow valve), dynamically compensate for pressure deviation through the AO (Analog Output) function, ensure that the deposition rate is stable within the target range of 10-500nm/min, and directly affect the thickness uniformity of the chip insulation layer and metal wiring layer.
2. End point and rate control of etching process
In the dry etching process, its application depth is closely related to product yield:
Endpoint detection support: Receive the optical signal analog quantity (corresponding to the characteristic wavelength of different materials etched) transmitted by the reaction chamber optical sensor, preprocess it and transmit it to the main controller to provide raw data for the "etching endpoint determination algorithm", avoiding damage to the silicon substrate caused by excessive etching or circuit short circuit caused by insufficient etching;
Dynamic rate adjustment: Based on the feedback signal from the etching rate sensor (usually at the nm/s level), output precise current signals to control the power of the RF power supply, ensuring that the etching rate deviation is controlled within ± 5%, and adapting to the graphic requirements of different devices such as logic chips and storage chips.
AMAT Applied Materials 0100-09022探测器板组件 产品展示
产品视频
3.其他产品
ABB 1SFA619550R1071 紧急停止按钮
DANAHER ZMP-SYNQNET-PCI 运动控制模块
SOCAPEL SOCASIN ST1/25-310 交流电伺服器
4.其他英文产品
PU519 3BSE018681R1 controller board
NI SCXI-1000 Machine box
RELIANCE WR-D4007 Semiconductor module
| 710-327128-005 | 531X100CCHBCG1 | 710-658036-20 |
| 710-327127-006 | 193X804ADG01 | F31X134EPRBNG1 |
| 710-303063-00 | 6DD1684-0EA0 | F31X133PRUAPG1 |
| 710-302407-00 | 03-10484-00 | F31X118CCAACG1 |
| 70-28255-01 | 03-290206-00 | 700-733242-001 |
| 700-661726-00 | 02-00072-00 | 710-450320-00 |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
