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AMAT Applied Materials 0010-09198安瓿组装

发布时间:2025-09-30人气:
  • AMAT Applied Materials 0010-09198安瓿组装
  • AMAT Applied Materials 0010-09198安瓿组装
  • AMAT Applied Materials 0010-09198安瓿组装

AMAT Applied Materials 0010-09198安瓿组装

1.产 品 资 料 介 绍:

一、产品核心定位
AMAT 0010-09198 安瓿组装是应用材料公司专为半导体高端制程特种气体输送设计的密封式气体储存与释放组件,属于半导体工艺中 “高精度气体供给单元” 的核心组成部分。其核心功能是在超洁净、高密封环境下,储存光刻、刻蚀等工艺所需的高纯度特种气体(如稀有金属有机化合物、高腐蚀性气体),通过精准的破裂或开启机制,实现气体的定量、无杂质释放,为制程提供稳定、纯净的气体源,是保障先进制程(如 7nm 及以下)工艺精度与晶圆良率的关键组件。
与通用工业安瓿不同,该组装采用半导体级耐腐蚀材料与超洁净密封工艺,可避免气体与外界接触产生污染,同时耐受高压(或负压)环境,适配半导体洁净车间 Class 1 级洁净度要求,且具备防泄漏、防误操作的安全设计。
二、核心结构与技术参数(基于半导体安瓿通用标准推导)
结合 AMAT 气体输送系统技术规范及半导体特种气体安瓿特性,该组装核心规格推测如下:
参数类别
规格说明
主体结构与材质
安瓿瓶体采用硼硅玻璃(或 Hastelloy 合金,依气体类型适配),壁厚 1.2-2.0mm;配套不锈钢 316L 阀门组件,密封接口采用 VCR 标准
密封与洁净度
初始密封真空度 ≤1×10⁻⁸ Torr,内部颗粒度控制在 ≥0.1μm 颗粒≤1 个 /cc;气体纯度适配 ≥99.99999%(7N 级)特种气体要求
容量与操作特性
有效容积 5-50mL(依工艺需求分规格),开启方式为机械穿刺式(或电致破裂式),开启压力控制在 0.3-0.8MPa
环境与兼容特性
工作温度 -40-80℃,耐受温度波动 ±5℃/h;兼容 HF、Cl₂、SiH₄ 等腐蚀性 / 易燃易爆气体,抗腐蚀等级符合 ISO 10289 标准
安全与认证
集成过压保护阀(爆破压力 1.5 倍额定工作压力);符合 SEMI G13 气体安全标准及 RoHS 环保认证
三、应用场景与适配系统
1. 核心应用领域
作为特种气体的 “洁净储存载体”,该安瓿组装主要服务于半导体制程中对气体纯度要求极高的环节:
  • 先进光刻工艺:储存光刻胶辅助气体(如有机金属化合物气体),通过精准释放控制光刻胶涂覆均匀性,保障光刻图案精度
  • 原子层沉积(ALD):为 ALD 工艺提供高纯度金属源气体(如 TiCl₄、HfCl₄),实现薄膜的单原子层级沉积,控制膜厚精度
  • 等离子体刻蚀:储存高选择性刻蚀气体(如 CF₄ 与 O₂ 混合气体),避免气体在输送过程中与空气反应,保障刻蚀图形侧壁垂直度

AMAT Applied Materials 0010-09198安瓿组装 英文资料:

1、 Product core positioning

AMAT 0010-09198 Ampoule Assembly is a sealed gas storage and release component designed by Applied Materials for the transportation of special gases in high-end semiconductor processes. It is a core component of the "high-precision gas supply unit" in semiconductor processes. Its core function is to store high-purity specialty gases (such as rare metal organic compounds and highly corrosive gases) required for photolithography, etching, and other processes in an ultra clean and highly sealed environment. Through precise rupture or opening mechanisms, it achieves quantitative and impurity free gas release, providing a stable and pure gas source for the process. It is a key component to ensure the precision and wafer yield of advanced processes (such as 7nm and below).

Unlike general industrial ampoules, this assembly uses semiconductor grade corrosion-resistant materials and ultra clean sealing technology, which can avoid pollution caused by gas contact with the outside world, and can withstand high pressure (or negative pressure) environments. It is suitable for Class 1 cleanliness requirements in semiconductor cleanrooms and has a safety design that prevents leakage and misoperation.

2、 Core structure and technical parameters (derived based on the general standard for semiconductor ampoules)

Based on the technical specifications of AMAT gas delivery system and the characteristics of semiconductor special gas ampoules, the core assembly specifications are speculated as follows:


Parameter category

Specification Description

Main structure and materials

The ampoule body is made of borosilicate glass (or Hastelloy alloy, depending on the gas type), with a wall thickness of 1.2-2.0mm; it is equipped with stainless steel 316L valve components, and the sealing interface adopts VCR standard

Sealing and Cleanliness

Initial sealing vacuum degree ≤ 1 × 10 ⁻⁸ Torr, internal particle size controlled at ≥ 0.1 μ m particles ≤ 1/cc; gas purity adapted to ≥ 99.99999% (7N level) special gas requirements

Capacity and operational characteristics

Effective volume of 5-50mL (depending on process requirements), opening method is mechanical puncture (or electric rupture), and the opening pressure is controlled at 0.3-0.8MPa

Environment and compatibility characteristics

Working temperature -40-80 ℃, withstand temperature fluctuations ± 5 ℃/h; compatible with corrosive/flammable and explosive gases such as HF, Cl ₂, SiH ₄, etc., with corrosion resistance level in accordance with ISO 10289 standard

Security and Certification

Integrated overpressure protection valve (burst pressure 1.5 times rated working pressure); Compliant with SEMI G13 gas safety standards and RoHS environmental certification


3、 Application scenarios and adaptation systems

1. Core application areas

As a "clean storage carrier" for specialty gases, this ampoule assembly mainly serves the extremely high gas purity requirements in semiconductor processes:

Advanced photolithography process: Store photoresist auxiliary gases (such as organic metal compound gases), control the uniformity of photoresist coating through precise release, and ensure the accuracy of photolithography patterns

 AMAT Applied Materials 0010-09198安瓿组装 产品展示      

0010-09198_teos_ampule_assembly_ampoule_applied_materials_amat_3.jpg

 产品视频

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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